distant areas: Static units are generally situated remotely, escalating Charge and lowering General technique performance.

thirty% of its peak power intake, offering our prospects major reduction in functioning expenditures and improved trustworthiness.

the knowledge below is classified by semiconductor procedure and tool company. Every table consists of an Applications Matrix that shows qulified and professional processes.

Originally Started in 1985, our enterprise has developed into a regarded chief in providing temperature Manage systems to the global semiconductor business.

This amazing program, featuring a little kind variable, affordable-of-Ownership and Dynamic Temperature Command provided procedure and tools engineers a brand new Software to improve their temperature sensitive procedures.

We are guided within our perception that prosperity Within this aggressive business stems from furnishing consumers with highly engineered new items and planet course customer support.

All static TCUs need surplus cooling & heating capacities because of their really large method fluid reservoirs. the method fuid reservoir on LAUDA-Noah's dynamic temperature control system is less than one gallon.

With the POU3300, you are able to attain unparalleled results in etch effectiveness, chamber uptime, diminished cost of possession and fab Area utilization – all while improving upon your process reliability.

the information pertains into a 300mm chamber temperature profile all through a significant component ratio Etch process, running at quite superior RF check here electrical power circumstances (~3.8kW). The powerful facets of this data established are:

LAUDA-Noah is meeting these new worries and has integrated Power conserving technological innovation in systems which might be pleasant to the setting and possess a low cost to work.

the info set Here's from the 200mm volume generation wafer fab and Evidently illustrates the good thing about the LAUDA-Noah POU system.

over ever, shrinking unit geometries, demanding new processes along with a extremely competitive environment involve temperature Handle techniques that Incorporate fast and accurate temperature Handle using an emphasis on reduced running charges and improved dependability.

the fact is the fact that real Dynamic Temperature Manage can only be attained when all 5 (5) of the following method design and set up specifications are achieved:

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We demand significantly less cooling/heating capability for the same application for a static TCU due to our tiny reservoir quantity.